Picosecond ultraviolet laser cutting machine is suitable for cutting, punching, surface microstructure (biomimetic structure), marking, groove processing of ultra-thin metal materials (copper, gold, silver, aluminum, titanium, nickel, stainless steel, molybdenum, etc.), flexible materials (PET, PI, PP, PVC, PTFE, electromagnetic film, adhesive film, etc.), graphene, carbon fiber, silicon wafer, ceramics, FPC and other materials, as well as micro processing of polymer materials and composite materials. The equipment has a wide range of uses and applicability, and can achieve surface micro processing of various types of materials. It can be customized to control depth and width, and achieve functions such as surface peeling, etching, marking, grooving, drilling, and cutting of materials.

Product Features

1.Using picosecond ultraviolet laser, ultra short pulse ultraviolet cold laser processing has almost no heat conduction, suitable for high-speed cutting, etching, line cutting, groove cutting, and drilling of any organic and inorganic material, with a minimum of 3 μ m edge breakage and heat affected zone.

2.CCDVisual pre scanning&automatic target positioning processing, importing drawings for automatic processing, easy and fast operation.

3.Excellent beam quality, good long-term stability, and negligible thermal effects.

4. Higher single pulse energy, higher processing accuracy, can achieve fine processing of almost any solid material.

5.Excellent processing flexibility, can carry out fine cutting of any shape, including arc, straight line, oblique line, etc.

6. The independently developed software control system can customize and upgrade various functions according to customer requirements, and configure single or dual head work according to requirements.

Applied Materials and Fields

Application materials:Various types of ultra-thin metal, non-metal thin films, graphene, carbon fiber, silicon wafers, ceramics FPC、PI、PET、PVC、 Processing of materials such as Teflon, as well as microfabrication of some polymer materials and materials that meet the requirements.

Application areas:Research fields in universities include biomimetic structures, semiconductor electronics, aerospace, automotive, biomedicine, etc.

Technical Parameter